Plating On Plastic

The POP process has no lead, no chromium and meets the requirements of RoHS; it is an environmentally friendly and non refractory chelating agent, so it is easy to treat the wastewater. Strong function and wide operating range, the appearance of the plating workpiece meticulous, good adhesion, thermal cycling (3Cycle) and CASS to 80hrs, has been widely used in automobile and bicycle parts, plastic accessories, bathroom accessories, lighting parts, furniture, accessories and other electronic products 3C. Good flatness, acid copper no pinhole, no pitting, bright luster and good ductility and displacement plating, four nickel low stress, good corrosion resistance, easy to control the bath. This process can be used for ABS and ABS+PC (less than 50%) materials. If PC content is greater than 50%, Sweller or Double Etch is recommended to enhance bonding strength.

POP Process Product Introduction
Cleaning M-Plas 900 Quickly removes an oil and grease residues from the surface without
damaging plastic substrate.
Sweller M-Plas 910 To surface swell specific grades of polycarbonate resin prior to etching thus
promoting maximum adhesion of the subsequent electroless deposit to the
substrate and ABS polycarbonate alloys.
Etching M-Plas 920 Decreases etch surface tension, thereby allowing the etch to uniformly attack
the plastic surface and promotes rapid solution drainage from etched parts.
Neutralizer M-Plas 930 Removes the Cr+6 ions remained on the surface after an etching process.
Enhances the Pd adhesion on the surface.
Activator M-Plas 940 Enhances the Pd metal stability and adsorption on the surface of the plastics
for the subsequent electroless nickel plating process.
Accelerator M-Plas 950 Removes excess inhibitory tin and weakly absorbed palladium. 
Exposes the active catalytic palladium metal nuclei.
Prolong the life of the electroless plating solution.
Electroless Ni M-Plas 960 Electroless deposition on the activated surface of the plastics.
Enhances the smooth and continues deposition.